American Semiconductor designs, manufactures, and integrates ultra-thin electronic chips (technically called flexible integrated circuits – FleX™ IC’s) to enable the flexible hybrid electronics (FHE) while also enabling traditional electronic applications to dramatically reduce product thickness creating smart-labels and smart-structure products. The proprietary Chip Scale Packaging (CSP) technology that makes FleX™ ICs possible is Semiconductor-on-Polymer (SoP). SoP interest and adoption is dev...